業績 Publication

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国際学会 International Conferences | 国内学会 Domestic Conferences | 招待講演 Invited Talks | 書籍 Books | 受賞 Awards | 研究資金 Research Grants

学術論文 Journal Articles

* : Corresponding author

  1. A. Miyawaki, M. S. Al Farisi*, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Catheter Probe System with Remotely Located Sensor for Simultaneous Airflow and Pressure Measurement of Exhalation Inside Lung Airway,” submitted.
  2. M. S. Al Farisi*, J. Okazaki, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Non-Contact Sensor Module for Rapid Detection of Extravasation During Intravenous Drug Administration,” submitted.
  3. M. N. Mohamed Zukri*, M. S. Al Farisi, Y. Hasegawa, M. Shikida: “Laser Micromachining 3D Free Standing Structure of MEMS Thermal Flow Sensor,” submitted.
  4. M. S. Al Farisi*, S. Toyota, Y. Hasegawa, M. Shikida: “Laser Ablation for Time Response Suppression of Flexible MEMS Thermal Sensors,” submitted.
  5. K. Horie, M. S. Al Farisi*, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Proof of Concept Quantitative Monitoring of Respiration Using Low-Energy Wearable Piezoelectric Thread,” Electronics, accepted (2024).
  6. R. Nagayama, M. S. Al Farisi*, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Tracheal Intubation Tube with Embedded Airflow Sensor for Respiration Monitoring During Canine Tartar Removal,” IEEJ Trans. Sens. Micromachines 144 (12), in press (2024).
    • In Japanese: 永山蓮, M. S. Al Farisi, 長谷川義大, 松島充代子, 川部勤, 式田光宏: “歯石除去中の呼吸管理を可能とする流量センサ付き気管挿管チューブ” 電気学会論文誌E(センサ・マイクロマシン部門誌) 144 (12), in press (2024).
  7. K. Horie, M. S. Al Farisi*, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Investigation of Calibration Methodology Using Mouth Airflow for Wearable Sensor Toward Quantitative Monitoring of Respiration,” IEEJ Trans. Electr. Electron. Eng. 19 (5), pp. 800–806 (2024). (Read only) (IF: 1.0)
  8. A. Miyawaki, M. S. Al Farisi*, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Pitot Tube Sensor Probe System for Simultaneous Airflow and Pressure Measurement of Expiration Inside Pulmonary Airway,” IEEJ Trans. Electr. Electron. Eng. 19 (5), pp. 807–813 (2024). (Read only) (IF: 1.0)
  9. M. S. Al Farisi*, Y. Wang, Y. Hasegawa, M. Shikida: “Facile Packaging for Fiber-Shaped Flexible MEMS Thermal Accelerometer,” IEEE Sens. Lett. 7 (11), p. 2504704 (2023). (Preprint: TechRxiv:24312913) (IF: 2.8)
  10. M. S. Al Farisi*, Y. Wang, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Facile In-Tube-Center Packaging of Flexible Airflow Rate Microsensor for Simultaneous Respiration and Heartbeat Measurement,” IEEE Sens. J. 23 (12), pp. 12626–12633 (2023). (Preprint: TechRxiv:22720810) (IF: 4.3)
  11. T. Tsukada, Y. Hasegawa*, M. S. Al Farisi, M. Matsushima, T. Kawabe, M. Shikida: “Analysis of Airstream Inside the Slip Joint of Tracheal Intubation Tube for Breathing Measurement,” IEEJ Trans. Sens. Micromachines 143 (1), pp. 6–12 (2023).
    • Journal title in Japanese: 電気学会論文誌E(センサ・マイクロマシン部門誌).
  12. T. Tsukada, R. Takigawa, Y. Hasegawa*, M. S. Al Farisi, M. Shikida*: “Sensitivity Enhancement of Tube-Integrated MEMS Flow Sensor using Flexible Copper on Polyimide Substrate,” Micromachines 14 (1), p. 42 (2023). (IF: 3.532)
  13. M. S. Al Farisi*, T. Tsukamoto, S. Tanaka: “Electroplated Al Press Marking for Wafer-Level Bonding,” Micromachines 13 (8), p. 1221 (2022). (IF: 3.532)
  14. M. S. Al Farisi*, T. Tsukamoto, S. Tanaka: “Mechanical hardening of electrochemically deposited aluminum from chloroaluminate ionic liquid,” Scr. Mater. 213, p. 114599 (2022). (IF: 6.3)
  15. M. Shikida*, Y. Hasegawa, M. S. Al Farisi, M. Matsushima, T. Kawabe: “Advancements in MEMS technology for medical applications: microneedles and miniaturized sensors,” Jpn. J. Appl. Phys. 61, p. SA0803 (2022). (IF: 1.48)
  16. M. S. Al Farisi*, T. Tsukamoto, S. Tanaka: “Tailoring material properties of electrochemically deposited Al film from chloroaluminate ionic liquid for microsystem technology using pulsed deposition,” Sens. Act. A Phys. 316, p. 112384 (2020). (IF: 2.739)
  17. M. S. Al Farisi*, H. Hirano, S. Tanaka: “Zero-Balance Method for Evaluation of Sealed Cavity Pressure Down to Single Digit Pa Using Thin Silicon Diaphragm,” J. Microelectromech. Syst. 29 (3), pp. 418–426 (2020). (IF: 2.621)
  18. M. J. Khan*, T. Tsukamoto, M. S. Al Farisi, S. Tanaka: “Fabrication Method of Micromachined Quartz Glass Resonator Using Sacrificial Supporting Structures,” Sens. Act. A Phys. 305, p. 111922 (2020). (IF: 2.739)
  19. Y. Sato*, A. Kobayashi, M. S. Al Farisi, T. Wanxin, K. Sugiyasu, M. Matsumoto: “Investigation on Relief Supplies for Home Evacuees after the Great East Japan Earthquake -Case of Iwaki City, Fukushima Prefecture”, Coll. Great East J. Earthquake, Inst. Soc. Safety Sci._ 8, pp. 19–22 (2019).
    • In Japanese: 佐藤悠司, 小林陽成, M. S. Al Farisi, 唐万新, 杉安和也, 松本行真: “東日本大震災における在宅避難者への物資支援に関する調査と考察-福島県いわき市を対象として-” 地域安全学会東日本大震災特別論文集 8 pp. 19–22 (2019).
  20. T. Seki*, M. S. Al Farisi, H. Tetsuka, S. Ishibashi, Y. Kumagai, N. Araya, M. Kuri: “Support activities aimed at dissemination of voluntary and sustainable education for disaster mitigation: an example of the Disaster Mitigation Action Card Game”, Tohoku J. Natural Disaster Sci. 55, pp. 209–214 (2019).
    • In Japanese: 関亜美, M. S. Al Farisi, 手塚寛, 石橋信治, 熊谷裕太, 新谷直己, 久利美和: “自主的・持続的な防災教育活動の普及を目指した実施支援 -減災アクションカードゲームを例にー” 東北地域災害科学研究 55 pp. 209–214 (2019).
  21. H. Tetsuka*, M. S. Al Farisi, T. Seki, Y. Kumagai, N. Araya, K. Miyanabe, M. Kuri: “Investigation of effective education for disaster mitigation by utilizing liquefaction experiment”, Tohoku J. Natural Disaster Sci. 55, pp. 203–208 (2019).
    • In Japanese: 手塚寛, M. S. Al Farisi, 関亜美, 熊谷裕太, 新谷直己, 宮鍋慶介, 久利美和: “液状化実験を活用した効果的な防災教育の検討” 東北地域災害科学研究 55 pp. 203–208 (2019).
  22. M. S. Al Farisi*, S. Hertel, M. Wiemer, T. Otto: “Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid towards Microsystems Application”, Micromachines 9 (11), p. 589 (2018). (IF: 2.222)
  23. M. S. Al Farisi*, H. Hirano, S. Tanaka: “Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging,” Sens. Act. A Phys. 279, pp. 671–679 (2018). (IF: 2.311)
  24. R. Kaneko*, M. S. Al Farisi, S. Yamada, M. Kuri: “Evaluation of the Disaster Mitigation Action Card Game for International Students in Japan”, Tohoku J. Natural Disaster Sci. 54, pp. 279-284 (2018).
    • Journal title in Japanese: 東北地域災害科学研究.
  25. M. S. Al Farisi*, H. Hirano, J. Frömel, S. Tanaka: “Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting”, J. Micromech. Microeng. 27 (1), p. 015029 (2017). (IF: 1.794)