Muhammad Salman Al Farisi

Muhammad Salman Al Farisi

Junior Associate Professor of Biomedical Information Sciences, Hiroshima City University

業績 Publication

You can also find statistics regarding my publications on my Google Scholar, Scopus, Web of Science and ORCID.

学術論文 Journal Articles | 国内学会 Domestic Conferences | 招待講演 Invited Talks | 書籍 Books | 受賞 Awards | 研究資金 Research Grants

国際学会 International Conferences

  1. K. Horie, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Investigation on Calibration Methodology for Wearable Piezoelectric Sensor Thread Using Airflow Sensor for Quantitative Respiration Measurement,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), accepted (2024).
  2. A. Sueyoshi, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Slip Joint Adaptor Enabling Respiration Airflow Measurement in Tracheal Intubation Tube,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), accepted (2024).
  3. Y. Yoshimura, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Hybrid Integration of Airflow Sensor and CO2 Sensor for Respiration Measurement,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), accepted (2024).
  4. R. Nagayama, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Integrating Flexible Airflow Sensor into Tracheal Intubation Tube for Respiration Monitoring During Canine Tartar Removal,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), accepted (2024).
  5. A. Miyawaki, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Safety Enhancement Consideration of Pitot Tube Sensor Probe Towards Airflow Measurement of Exhalation Inside Pulmonary Airway,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), accepted (2024).
  6. M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Flexible MEMS Thermal Sensor Using Cost-Effective Metallization: Al”, In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), accepted (2024).
  7. M. S. Al Farisi, Y. Wang, Y. Hasegawa, M. Shikida: “Facile Packaging for Fiber-Shaped Flexible MEMS Thermal Accelerometer,” In 11th IEEE Int. Symp. on Inertial Sensors & Systems (INERTIAL), p. A3L-A-3 (2024).
  8. N. K. Putra, F. A. Dinata, M. Iqbal, M. S. Al Farisi: “Trials on MEMS sensor utilization on 3D printed intravascular flow model”, In 12th Asian-Pacific Conference on Biomechanics (AP-Biomech), p. 112 (2023).
  9. M. S. Al Farisi, S. Toyota, Y. Hasegawa, M. Shikida: “Laser Processing for Time Response Enhancement of Flexible MEMS Thermal Sensors”, In 36th Int. Microprocesses and Nanotechnology Conf. (MNC), p. 17D-1-4 (2023).
  10. S. H. Lee, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Embedding Airflow Sensing Function in Balloon Catheter for Respiration Measurement in Bronchus Region Inside Lung”, In 36th Int. Microprocesses and Nanotechnology Conf. (MNC), p. 17D-1-5 (2023).
  11. R. Nagayama, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Tracheal Intubation Tube with Embedded Flow Sensor for Respiration and Heartbeat Monitoring During Canine Tartar Removal”, In 36th Int. Microprocesses and Nanotechnology Conf. (MNC), p. 17P-1-61 (2023).
  12. F. A. Dinata, M. S. Al Farisi, M. Iqbal, N. K. Putra: “Development of a Flow Simulator for Evaluation of Hemodynamics Computational Simulation”, In 2023 8th Int. Conf. Instrumentation, Control, and Automation (ICA), pp. 213–217 (2023).
  13. M. S. Al Farisi, Y. Wang, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “In-tube-center packaging of flexible MEMS airflow-rate sensor and its sensitivity enhancement”, In 2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 800–803 (2023).
  14. K. Horie, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Calibration method for wearable sensor using airflow at mouth for quantitative monitoring of respiration and heartbeat”, In 2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 1872–1875 (2023).
  15. A. Miyawaki, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Simultaneous airflow and pressure measurements based on pitot tube for evaluation of expired air inside lung airway”, In 2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 1888–1891 (2023).
  16. T. Tsukada, Y. Hasegawa, M. S. Al Farisi, S. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Wireless MEMS Thermal Flow Sensor System Integrated On Medical Mask For Emergency Medical Treatment”, In 10th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2022), p. A0110 (2022).
  17. S. Wang, M. S. Al Farisi, J. Chen, T. Tsukamoto, S. Tanaka: “Dual-Mass Resonator with Dynamically Balanced Structure for Roll/Pitch Rate Integrating Gyroscope”, In 2021 IEEE Sensors, pp. 1–4 (2021).
  18. M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Fully CMOS-compatible wafer bonding based on press marking using thick electroplated aluminum”, In 2021 21th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 1138–1141 (2021).
  19. M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Electrochemically Deposited Aluminum for MEMS Thermal Actuator”, In 2021 Smart Systems Integration (SSI), pp. 90–93 (2021).
  20. M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Influence of Additive Inclusion on Hardness of Electroplated Al Film with Nanometer-Level Flatness from Chloroaluminate Ionic Liquid”, In Pacific Rim Meeting on Electrochemical & Solid State Science (PRiME) 2020 Meet. Abstr. MA2020-02, p. 1792 (2020).
  21. S. Wang, M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Roll/Pitch Rate Integrating MEMS Gyroscope Using Dynamically Balanced Dual-Mass Resonator”, In 2020 IEEE Int. Symp. Inertial Sensors and Systems (INERTIAL), pp. 1–4 (2020).
  22. M. S. Al Farisi, H. Hirano, S. Tanaka: “Sealed cavity pressure evaluation from 1 Pa to over 10 kPa using thin diaphragm for MEMS vacuum packaging”, In 2019 IEEE 32nd Int. Conf. Micro Electro Mechanical Syst. (MEMS), pp. 1045–1048 (2019).
  23. M. S. Al Farisi, S. Hertel, M. Wiemer, T. Otto: “Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application”, In 2018 Int. Conf. Electron. Packaging iMAPS All Asia Conf. (ICEP-IAAC), pp. 415–418 (2018).
  24. M. S. Al Farisi, K. Tanaka, H. Hirano, S. Tanaka: “250°C wafer-level vacuum sealing using electroplated copper bonding frame planarized by fly-cutting,” In 2017 19th Int. Conf. Solid-State Sensors Actuators and Microsystems (TRANSDUCERS), pp. 1191–1194 (2017).
  25. M. S. Al Farisi, H. Hirano, S. Tanaka, H. Miura: “Grain refining of metal surface by mechanical cutting for low-temperature wafer-level vacuum bonding,” In 2nd USTB-TU Joint Workshop on Advanced Materials and Manufacture, Abstracts 2 p. 6 (2017).
  26. M. S. Al Farisi, H. Hirano, S. Tanaka: “Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps,” In 2016 11th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS), pp. 573–577 (2016).