業績 Publication
You can also find statistics regarding my publications on my Google Scholar, Scopus, Web of Science and ORCID.
学術論文 Journal Articles | 国内学会 Domestic Conferences | 招待講演 Invited Talks | 書籍 Books | 受賞 Awards | 研究資金 Research Grants
国際学会 International Conferences
- M. N. Mohamed Zukri, M. S. Al Farisi, Y. Hasegawa, M. Shikida: “Single-Step Laser Fabrication of 3D Free-Standing Origami MEMS Thermal Sensor,” In 2024 IEEE Sensors, p. 6273 (2024).
- A. Sueyoshi, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Slip Joint Adaptor Enabling Respiration Airflow Measurement in Tracheal Intubation Tube,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), pp. 272–273 (2024).
- A. Miyawaki, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Safety Enhancement Consideration of Pitot Tube Sensor Probe Towards Airflow Measurement of Exhalation Inside Pulmonary Airway,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), pp. 274–275 (2024).
- Y. Yoshimura, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Hybrid Integration of Airflow Sensor and CO2 Sensor for Respiration Measurement,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), pp. 375–376 (2024).
- M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Flexible MEMS Thermal Sensor Using Cost-Effective Metallization: Al,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), pp. 377–378 (2024).
- K. Horie, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Investigation on Calibration Methodology for Wearable Piezoelectric Sensor Thread Using Airflow Sensor for Quantitative Respiration Measurement,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), pp. 438–439 (2024).
- R. Nagayama, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Integrating Flexible Airflow Sensor into Tracheal Intubation Tube for Respiration Monitoring During Canine Tartar Removal,” In 11th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2024), pp. 448–449 (2024).
- M. S. Al Farisi, Y. Wang, Y. Hasegawa, M. Shikida: “Facile Packaging for Fiber-Shaped Flexible MEMS Thermal Accelerometer,” In 11th IEEE Int. Symp. on Inertial Sensors & Systems (INERTIAL), p. A3L-A-3 (2024).
- N. K. Putra, F. A. Dinata, M. Iqbal, M. S. Al Farisi: “Trials on MEMS sensor utilization on 3D printed intravascular flow model”, In 12th Asian-Pacific Conference on Biomechanics (AP-Biomech), p. 112 (2023).
- M. S. Al Farisi, S. Toyota, Y. Hasegawa, M. Shikida: “Laser Processing for Time Response Enhancement of Flexible MEMS Thermal Sensors”, In 36th Int. Microprocesses and Nanotechnology Conf. (MNC), p. 17D-1-4 (2023).
- S. H. Lee, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Embedding Airflow Sensing Function in Balloon Catheter for Respiration Measurement in Bronchus Region Inside Lung”, In 36th Int. Microprocesses and Nanotechnology Conf. (MNC), p. 17D-1-5 (2023).
- R. Nagayama, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Tracheal Intubation Tube with Embedded Flow Sensor for Respiration and Heartbeat Monitoring During Canine Tartar Removal”, In 36th Int. Microprocesses and Nanotechnology Conf. (MNC), p. 17P-1-61 (2023).
- F. A. Dinata, M. S. Al Farisi, M. Iqbal, N. K. Putra: “Development of a Flow Simulator for Evaluation of Hemodynamics Computational Simulation”, In 2023 8th Int. Conf. Instrumentation, Control, and Automation (ICA), pp. 213–217 (2023).
- M. S. Al Farisi, Y. Wang, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “In-tube-center packaging of flexible MEMS airflow-rate sensor and its sensitivity enhancement”, In 2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 800–803 (2023).
- K. Horie, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Calibration method for wearable sensor using airflow at mouth for quantitative monitoring of respiration and heartbeat”, In 2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 1872–1875 (2023).
- A. Miyawaki, M. S. Al Farisi, Y. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Simultaneous airflow and pressure measurements based on pitot tube for evaluation of expired air inside lung airway”, In 2023 22th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 1888–1891 (2023).
- T. Tsukada, Y. Hasegawa, M. S. Al Farisi, S. Hasegawa, M. Matsushima, T. Kawabe, M. Shikida: “Wireless MEMS Thermal Flow Sensor System Integrated On Medical Mask For Emergency Medical Treatment”, In 10th Asia-Pacific Conf. Transducers Micro-Nano Technol. (APCOT 2022), p. A0110 (2022).
- S. Wang, M. S. Al Farisi, J. Chen, T. Tsukamoto, S. Tanaka: “Dual-Mass Resonator with Dynamically Balanced Structure for Roll/Pitch Rate Integrating Gyroscope”, In 2021 IEEE Sensors, pp. 1–4 (2021).
- M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Fully CMOS-compatible wafer bonding based on press marking using thick electroplated aluminum”, In 2021 21th Int. Conf. Solid-State Sensors Actuators and Microsystems (Transducers), pp. 1138–1141 (2021).
- M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Electrochemically Deposited Aluminum for MEMS Thermal Actuator”, In 2021 Smart Systems Integration (SSI), pp. 90–93 (2021).
- M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Influence of Additive Inclusion on Hardness of Electroplated Al Film with Nanometer-Level Flatness from Chloroaluminate Ionic Liquid”, In Pacific Rim Meeting on Electrochemical & Solid State Science (PRiME) 2020 Meet. Abstr. MA2020-02, p. 1792 (2020).
- S. Wang, M. S. Al Farisi, T. Tsukamoto, S. Tanaka: “Roll/Pitch Rate Integrating MEMS Gyroscope Using Dynamically Balanced Dual-Mass Resonator”, In 2020 IEEE Int. Symp. Inertial Sensors and Systems (INERTIAL), pp. 1–4 (2020).
- M. S. Al Farisi, H. Hirano, S. Tanaka: “Sealed cavity pressure evaluation from 1 Pa to over 10 kPa using thin diaphragm for MEMS vacuum packaging”, In 2019 IEEE 32nd Int. Conf. Micro Electro Mechanical Syst. (MEMS), pp. 1045–1048 (2019).
- M. S. Al Farisi, S. Hertel, M. Wiemer, T. Otto: “Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application”, In 2018 Int. Conf. Electron. Packaging iMAPS All Asia Conf. (ICEP-IAAC), pp. 415–418 (2018).
- M. S. Al Farisi, K. Tanaka, H. Hirano, S. Tanaka: “250°C wafer-level vacuum sealing using electroplated copper bonding frame planarized by fly-cutting,” In 2017 19th Int. Conf. Solid-State Sensors Actuators and Microsystems (TRANSDUCERS), pp. 1191–1194 (2017).
- M. S. Al Farisi, H. Hirano, S. Tanaka, H. Miura: “Grain refining of metal surface by mechanical cutting for low-temperature wafer-level vacuum bonding,” In 2nd USTB-TU Joint Workshop on Advanced Materials and Manufacture, Abstracts 2 p. 6 (2017).
- M. S. Al Farisi, H. Hirano, S. Tanaka: “Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps,” In 2016 11th IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems (NEMS), pp. 573–577 (2016).